High Thermal Conductivity Aluminum Core PCB
Aluminum substrate for high conductivity miner lamp
Item no.: UF0高导热铝基板
Category: High Thermal Conductivity Aluminum Core PCB
Category: High Thermal Conductivity Aluminum Core PCB
All kinds of high performance and high thermal conductivity aluminum substrate, copper substrate, copper aluminum composite board and COB mirror aluminum plate are developed by our company. The processing technology adopts thermoelectric separation structure to better solve the heat dissipation problems of some high-power LED lamps, especially for high power 100 watts -1000 watts LED lighting products to provide better heat dissipation effect. Products are widely used in LED lighting, high-power power, automotive, power, electronics, medical equipment, mechanical equipment and other fields.
Product details
10 years experience in research and manufacture of aluminum substrate, copper substrate, stage lamp thermal separation copper substrate, specializing in the production of aluminum substrate, copper substrate, stage lamp thermoelectric separation copper substrate.
Specifications
